Bustronic is your resource for the latest in the development of next-gen backplanes and systems. On a periodic basis, we will post news and advancements in the StarFabric (PICMG 2.17), Compact Packet Switching (cPSB, PICMG 2.16), Serial Mesh (PICMG 2.20), VXS (VITA 41), AdvancedTCA (PICMG 3.x), VME320, and optical backplanes.

StarFabric Backplane

StarGen SG2010 PCI-Fabric Bridge

StarGen's PCI-Fabric Bridge (SG 2010) device interfaces 64-bit or 32-bit PCI buses operating at 66 MHz or 33 MHz to StarGen's switch fabric. The bridge translates PCI traf-fic into serial frame format for transmission across the switch fabric. By connecting the bridge serial interfaces to other bridges or to StarGen's StarSwitch devices, flexible topologies can be designed to fit specific application requirements for bandwidth, reliability, and number of endpoints or slots. The PCI-Fabric Bridges are multi-function devices. The 'bridge' function supports legacy address routed traffic which provides 100% compatibility with existing PCI software including configuration, BIOS, OS, and drivers. The 'gateway' function provides fabric-native path and multicast routing capability and other enhanced features. The PCI interface can act as the primary or secondary PCI interface with a pin strap option. The fabric interface consists of two 2.5Gbps full duplex links providing 2.5Gbps bandwidth in both directions, simultaneously. Four aggregated 622Mbps LVDS differential pairs comprise each link. The two links can be bundled to create a 5Gbps full duplex link to another device or can be used separately for redundant connections.

PCI-Serial Bridge Features Scalability and Performance

  • 2 fabric interface links, 2.5Gbps, full duplex each link
  • Links can be bundled to create 5.0Gbps, full duplex point to point link

Compatibility

  • Support for three routing methods: standard PCI addressing (address routing), path routing, and multi-cast routing
  • Standard PCI addressing supports 100% PCI software compatibility
  • Compliant with the PCI Local Bus Specification Revision 2.2, the PCI to PCI Bridge Architecture Specification Revision 1.1, and the CompactPCI Hot Swap Specification
  • Physical layer interface is compliant with the IEEE 1596.3 and TIA/EIA-644 Low Voltage Differential Signaling (LVDS) Standards

For more information, visit http://www.stargen.com/technology.html

 

StarFabric Backplane

StarGen SG3010 TDM Bridge

The StarGen SG3010 TDM to StarFabric Bridge is a highly scalable, high-capacity device that is ideal for such next-generation applications as voice over Internet protocol (VoIP) gateways, voice over broadband (VoB) systems, wireless base stations, and other high-density communications network equipment. It provides a level of system scaling unattainable with current standard off-the-shelf time division multiplexed (TDM) components. The StarGen SG3010 provides an H.110 bus interface, a local TDM bus interface along with a StarFabric interface. The SG3010 enables system designers to scale to multiple H.110 buses and TDM buses over StarFabric. TDM devices including DSPs, Framers, and voice processors can be directly connected through the StarFabric serial switch interconnect and increase the overall capacity of next generation systems. The SG3010 maintains full H.110 TDM bus compatibility, preserving investments in existing circuit cards. The SG3010 is applicable as a telecommunications backplane and chassis-to-chassis interconnect solution.

 

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