Elma Bustronic
is your resource for the latest in the development of next-gen backplanes
and systems. On a periodic basis, we will post news and advancements
in the StarFabric (PICMG 2.17), Compact Packet Switching (cPSB,
PICMG 2.16), Serial Mesh (PICMG 2.20), VXS (VITA 41), GigE (VITA
31.1), AdvancedTCA (PICMG 3.0), CompactPCI Express (Exp 0), MicroTCA,
VPX (VITA 46), and optical backplanes.
Top
News
The
VITA 41 specification for the VXS switched serial backplane has
been ratified by VITA. The VXS backplane allows three options: plug
in standard VME64x cards for parallel bus use, integrate new payload
and switch cards for parallel bus and switch fabric transport, and
switch fabric transport only.Elma Bustronic has developed five types
of VXS backplanes. Card vendors have released a wealth of VXS products,
some details are below.
Background
The
VXS backplane is a Motorola-backed effort by VITA to bring switched
serial fabrics to VME. Part of the "VME Renaissance",
the VITA 41.0 specification for VXS has been ratified. VXS adds
a high-speed connector over P0 of a VME64x backplane for serial
data traffic. The VXS spec allows for four differential serial pairs
per direction link over P0, and supports up to two such ports on
each VMEbus card.The subsets of VITA 41 include InfiniBand (VITA
41.1), Rapid I/O (VITA 41.2), and may include GigaBit Ethernet (VITA
41.3), PCI Express (VITA 41.4) and StarFabric (VITA 41.5).
Industry
Articles
VXS
Backplane Design - A Closer Look
Backplane
Design Has Critical Role in New Specifications
Industry
Links
Elma
Bustronic
Elma Bustronic has announced a 5-slot Switchless Mesh VXS development
backplane. This unique backplane has point-to-point connections,
allowing prototyping and development without the expense of
a switch card. (More) |
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Elma
Bustronic
Elma Bustronic has developed a 20-slot Dual Star, 12-slot Dual
Star, 8-slot Dual Star, and a 5-slot Single Star VXS backplane
with special features for high performance. (More) |
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Elma Bustronic
Elma Bustronic has announced a new VXS Processor Mesh architecture with bandwidth that can deliver 112 Gbps of aggregate throughput within the processing mesh in a single chassis. The architecture will be proposed to VITA as a new standard to define alternative backplane topologies for VXS. (More)
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Tek
Micro
Quixilica
Callisto VXS-1 is the first VXS product to combine a high-density
FPGA processing platform with a digital I/O architecture that
provides an unprecedented full duplex I/O bandwidth of up
to 190 Gbits/s.(More) |
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Pentek
The first in a series of VXS products, the Model 6821 a single-channel,
6U VMEbus board featuring one of the fastest 12-bit analog-to-digital
(A/D) converters in the market with sampling rates to 215
MHz. (More)
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Top
News
The
PICMG 3.0 core specification for AdvancedTCA has been ratified since
December 2002. The sub-specifications for Ethernet (PICMG 3.1),
Infiniband (PICMG 3.2), StarFabric (PICMG 3.3), PCI Express (PICMG
3.4) and RapidIO (PICMG 3.5). The AdvancedTCA Interoperability Workshop
continue and are for any participant who brings working product
to test interoperability.
Bustronic
and sister company Elma TreNew have developed a 14-slot Dual Star,
14-slot Full Mesh, 16-slot Full Mesh, 5-slot Replicated Mesh and
2-slot Replicated Mesh ATCA backplanes (some details below).
* IPM Sentry
is a trademark of Pigeon Point Systems
Background
Advanced TCA,
via the PICMG 3.0 specification, is a major effort by over 100 companies
to develop a next-generation telecom architecture. The specification
is geared towards the telco carrier grade market. Utilizing Dual
Star, Dual Dual Star, and Mesh switched fabric topologies, the spec
will be able to handle the massive bandwidth requirements, High
Availability (99.999% uptime), and Quality of Service issues demanded
by the industry. The form factor will go to an 8U x 280mm card size
plugging into an approx. 5U (or 8U) backplane spaced at 1.2".
The larger cards allow more space for more components, while the
wider spacing between slots allows for taller components. In addition,
the backplane allows for 48VDC input from an external source to
be distributed to the individual slot cards.
Industry
Articles
IEEE
Presentation on ATCA Current Channels and Signaling Methodology
Measuring
the Actual Performance Characteristics of ATCA Backplanes with Signal
Integrity Analysis
Design
Considerations for PICMG 3.0 AdvancedTCA Backplanes
Taking AdvancedTCA to the Next Level:
From Development Units to Shelf Management
Integrating Shelf Management Solutions
into CompactPCI and AdvancedTCA Chassis Designs
Industry
Links
Elma
Bustronic, Elma TreNew
Elma
Bustronic and sister company Elma TreNew have co-developed a
14-slot Dual Star and a 5-slot Mesh backplane compliant to the
PICMG 3.0 specifications. (More). |
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Elma
Electronic
Elma Electronic has announced
a unique 5U ATCA Development Chassis that offers 48V DC to A/C
conversion for plugging to a conventional wall outlet. Also
features direct shelf manager plugging. A N+1 Redundant version
is expected shortly. (More).
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Elma
Electronic
Elma Electronic has developed
a 4U horizontal ATCA chassis and 12U and 13U vertical chassis
compliant to the PICMG 3.0 specifications. The Elma IPM Sentry
Shelf Manager is specifically designed for AdvancedTCA solutions.
(More).
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Elma
Electronic
The 2U ATCA chassis from Elma
uses 33% less rack space than any standard AdvancedTCA chassis
in the market today. Ideal for prototyping and development,
it features a 250W A/C power supply for versatility. (More). |
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ERNI
ERNI Components and Tyco International have developed the
ZD line of high-speed connectors, which was chosen as the
connector for the PICMG 3.0 specification (More).
FAQs
AdvancedTCA
FAQs (17KB)
AdvancedTCA
Short Form Specification
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Top News
MicroTCA is
one of the newest PICMG specifications in development. MicroTCA
defines a modular backplane architecture designed to support redundant "pods" of AdvancedMC (AMC) modules. The AdvancedMC modules (AMC0/.1/.2/.3)
are front removable mezzanine modules first designed to be used
on AdvancedTCA cards. The MicroTCA
specifications is expected to be completed later this year and early
adopters are beginning to build prototype products even prior to
the full document's release.
Background
The MicroTCA
architecture will allow large arrays of AdvancedMC modules to be
used in a wide array of applications where a lower cost solution
is required than could be achieved by the standard AdvancedTCA architecture.
The MicroTCA backplane allows single or redundant virtual carriers
to provide power management, platform management and fabric connections
to greater numbers of modules than a single physical carrier card
could support in a classic ATCA application. MicroTCA systems
will support up to 48 single width, half height AdvancedMC modules
in a 19" EIA rack or an assortment of full height modules either
in single or double widths. AdvancedMC modules are targeted for
such modular applications as storage arrays, firewalls, blade servers,
and even home entertainment centers. Each module may dissipate between
20 and 60 watts each and the platform management scheme is designed
to support applications from 99.99% to 99.999% availability. AdvancedMC
module specifications have already been released and the most recent,
AMC.3 (storage systems), is nearing completion.
Industry
Articles
Modular MicroTCA - Bringing Flexibility to MicroTCA Systems
MicroTCA 2008 E-Cast
Industry
Links
Elma Bustronic
Elma Bustronic developed a Dual Star MicroTCA backplane based upon the MicroTCA.0 Specification Rev 1.0. It features 10 AMC, 2
power, and 2 MCH slots in the full size. (More)
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Elma Bustronic
The first in the line of Elma Bustronic Pico backplanes is the MicroBox. It features slots for 6 AMC, 1 PM (Power Module), 1 MCH (MicroTCA Carrier Hub), 1 JSM (J-TAG Switch Module) and 2 CUs (Cooling Units). Compression-mount connectors are used in the backplane for increased reliability and superior (easier and more flexible) routing.
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Elma Electronic
Elma now offers ruggedized MicroTCA solutions in ATR and 19” rackmount versions. (More)
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Elma
Electronic
Elma has developed MicroTCA Subrack Chassis in 4U, 5U, 6U, 7U, and 8U heights. The units feature front air intake, rear exhaust, and hold up to 12 AMC modules in the Star version and 10 AMCs in the Dual Star version. (More)
Elma Electronic
Compliant to MicroTCA.0 specification, the MicroSlim is designed to offer the
performance benefits of MicroTCA within a space-saving 1U high platform.
Optimizing the available space (up to 10, mid-sized, single-width modules) the
MicroSlim Classic holds 6 x AMC modules while providing MCH and J-TAG Switch
Module (JSM) capability. Powered by a robust 380 watt PSU, the MicroBox box
converts 48VDC efficiently to the 3.3V and 12V’s needed to power the modules.(More)
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CompactPCI
Express (EXP0) |
Top News
Elma Bustronic
is completing the design of a 4-slot CompactPCI Express hybrid backplane.
It contains a system slot, one Type 1 slot, and two Type 2 slots.
Contact Elma Bustronic for more details. The high performance capability
of the new CompactPCI architecture makes possible performance levels
that will support such features as a new generation of video graphic
capability. The backward compatibility to CompactPCI and the wealth
of user available backplane IO of the P3, P4 and P5 connectors will
allow many new specialized applications to be supported while continuing
to support all existing card designs. PXI Express versions are also
coming soon.
Background
CompactPCI Express
supports the next generation Intel PCI Express architecture in the
familiar 6U-160 Eurocard form factor. CompactPCI Express connects
cards via a serial point-to-point bus with a read-only bandwidth
of up to (16x) 2.5 Gigabits/second or (8x) 2.5 Gigabits/second full
duplex bandwidth. CompactPCI Express provides support for several
different card for factors with connectivity in 1x, 2x 4x, and 8x
increments. Each link represents one full duplex 2.5 Gigabit/second
interconnect path. The support of legacy 32 or 64 bit CompactPCI
boards is accomplished by a PCIe to PCI-X bridge. CompactPCI boards
of 33MHz, 66MHz, or 133MHz are possible. Because the CompactPCI
Express architecture continues to support the P3, P4 and P5 in all
6U slot types, CompactPCI Express can continue to support for all
existing CompactPCI secondary architectures such as PICMG 2.5, 2.20,
2.16, 2.17 and 2.18 either as functions on native CompactPCI Express
cards or as legacy cards in the original CompactPCI form. Versions
for PXI Express will also be available.
Industry
Articles
The Power is the System
Industry
Links
Elma Bustronic
Elma Bustronic has developed a 3U CompactPCI Express backplane in 4-slots. It contains a system slot, one Type 1 slot, and two Type 2 slots. The backplane features a bridgeable section for a PCI-to-PCIe bridge. |
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Elma Bustronic, Elma TreNew
Elma Bustronic and sister company Elma TreNew developed this 6-slot CompactPCI Express backplane. This 3U version features two Type 1 slots, two Type 2 slots, and 2 legacy cPCI slots.
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