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AdvancedTCA Backplanes

ATCA Backplane

 Top News

The PICMG 3.0 core specification for AdvancedTCA has been ratified since December 2002. The sub-specifications for Ethernet (PICMG 3.1), Infiniband (PICMG 3.2), StarFabric (PICMG 3.3), PCI Express (PICMG 3.4) and RapidIO (PICMG 3.5). The AdvancedTCA Interoperability Workshop continue and are for any participant who brings working product to test interoperability.

Bustronic and sister company Elma TreNew have developed a 14-slot Dual Star, 14-slot Full Mesh, 16-slot Full Mesh, 5-slot Replicated Mesh and 2-slot Replicated Mesh ATCA backplanes (some details below).

* IPM Sentry is a trademark of Pigeon Point Systems

 

  


Background

Advanced TCA, via the PICMG 3.0 specification, is a major effort by over 100 companies to develop a next-generation telecom architecture. The specification is geared towards the telco carrier grade market. Utilizing Dual Star, Dual Dual Star, and Mesh switched fabric topologies, the spec will be able to handle the massive bandwidth requirements, High Availability (99.999% uptime), and Quality of Service issues demanded by the industry. The form factor will go to an 8U x 280mm card size plugging into an approx. 5U (or 8U) backplane spaced at 1.2". The larger cards allow more space for more components, while the wider spacing between slots allows for taller components. In addition, the backplane allows for 48VDC input from an external source to be distributed to the individual slot cards.


Industry Articles

IEEE Presentation on ATCA Current Channels and Signaling Methodology
Measuring the Actual Performance Characteristics of ATCA Backplanes with Signal Integrity Analysis
Design Considerations for PICMG 3.0 AdvancedTCA Backplanes
Taking AdvancedTCA to the Next Level: From Development Units to Shelf Management
Integrating Shelf Management Solutions
Tripling AdvancedTCA Backplane Performance While Reducing Costs - CompactPCI and AdvancedTCA Systems - September 2009

Feature Products

Elma Bustronic, Elma TreNew

Elma Bustronic and sister company Elma TreNew have co-developed a 14-slot Dual Star and a 5-slot Mesh backplane compliant to the PICMG 3.0 specifications. (More)
Elma Bustronic

Elma Bustronic has released new 2-slot, 5-slot, and 6-slot ATCA backplanes with dense connectors for plugging shelf managers.  The design saves space and can facilitate plugging of multiple shelf managers without increasing the chassis height and rack space required. (More)

Elma Bustronic, Z Plane Inc.

The Bustronic ATCA backplane with links offers up to triple the performance of traditional versions of the architecture at a reduced cost.  This is achieved using the Z-plane Links which carry the high speed signals with long traces via a small PCB board that plugs directly into the rear of the backplane.  (More)

Download Z Plane White Paper

         

Best of Show Award, ATCA Summit 2009
Elma Electronic

Elma Electronic has announced a unique 5U ATCA Development Chassis that offers 48V DC to A/C conversion for plugging to a conventional wall outlet. Also features direct shelf manager plugging. A N+1 Redundant version is now available. (More)


Elma Electronic

Elma Electronic has developed a 4U horizontal ATCA chassis and 12U and 13U vertical chassis compliant to the PICMG 3.0 specifications. The Elma IPM Sentry Shelf Manager is specifically designed for AdvancedTCA solutions. (More)

 
Elma Electronic

The 2U ATCA chassis from Elma uses 33% less rack space than any standard AdvancedTCA chassis in the market today. Ideal for prototyping and development, it features a 250W A/C power supply for versatility. (More)

ERNI

ERNI Components and Tyco International have developed the ZD line of high-speed connectors, which was chosen as the connector for the PICMG 3.0 specification (More)


FAQs
AdvancedTCA FAQs (17KB)
AdvancedTCA Short Form Specification