Bustronic provides custom design and manufacturing solutions for rigid-flex backplanes. There are several special considerations for flex designs, including:
- Mechanical design -- ensure flex is not strained or damaged. Careful that the flex does not bend sharply. The layers can bow and lose your reference plane.
- Routing -- impedance changes from flex to rigid, etc. Consider signal integrity issues.
- Conformal coating process -- proper coverlay for the polyimide material and masking for coating of the rigid part of the board.
- Layer limitations -- consider number of layers for flex design.
Contact Bustronic for more information about rigid-flex design or visit www.backplanedesign.com.