Elma Bustronic is your resource for the latest in the development of next-gen backplanes and systems. On a periodic basis, we will post news and advancements in the StarFabric (PICMG 2.17), Compact Packet Switching (cPSB, PICMG 2.16), Serial Mesh (PICMG 2.20), VXS (VITA 41), GigE (VITA 31.1), AdvancedTCA (PICMG 3.0), CompactPCI Express (Exp 0), MicroTCA, VPX (VITA 46), and optical backplanes.







VXS Backplane (VITA 41)

Top News

The VITA 41 specification for the VXS switched serial backplane has been ratified by VITA. The VXS backplane allows three options: plug in standard VME64x cards for parallel bus use, integrate new payload and switch cards for parallel bus and switch fabric transport, and switch fabric transport only.Elma Bustronic has developed five types of VXS backplanes. Card vendors have released a wealth of VXS products, some details are below.

Background

The VXS backplane is a Motorola-backed effort by VITA to bring switched serial fabrics to VME. Part of the "VME Renaissance", the VITA 41.0 specification for VXS has been ratified. VXS adds a high-speed connector over P0 of a VME64x backplane for serial data traffic. The VXS spec allows for four differential serial pairs per direction link over P0, and supports up to two such ports on each VMEbus card.The subsets of VITA 41 include InfiniBand (VITA 41.1), Rapid I/O (VITA 41.2), and may include GigaBit Ethernet (VITA 41.3), PCI Express (VITA 41.4) and StarFabric (VITA 41.5).

Industry Articles

VXS Backplane Design - A Closer Look
Backplane Design Has Critical Role in New Specifications

Industry Links

Elma Bustronic

Elma Bustronic has announced a 5-slot Switchless Mesh VXS development backplane. This unique backplane has point-to-point connections, allowing prototyping and development without the expense of a switch card. (More)
Elma Bustronic

Elma Bustronic has developed a 20-slot Dual Star, 12-slot Dual Star, 8-slot Dual Star, and a 5-slot Single Star VXS backplane with special features for high performance. (More)

Elma Bustronic

Elma Bustronic has announced a new VXS Processor Mesh architecture with bandwidth that can deliver 112 Gbps of aggregate throughput within the processing mesh in a single chassis. The architecture will be proposed to VITA as a new standard to define alternative backplane topologies for VXS. (More)

 

Tek Micro

Quixilica Callisto VXS-1 is the first VXS product to combine a high-density FPGA processing platform with a digital I/O architecture that provides an unprecedented full duplex I/O bandwidth of up to 190 Gbits/s.(More)

Pentek

The first in a series of VXS products, the Model 6821 a single-channel, 6U VMEbus board featuring one of the fastest 12-bit analog-to-digital (A/D) converters in the market with sampling rates to 215 MHz. (More)

 


AdvancedTCA (PICMG 3.x)

Top News

The PICMG 3.0 core specification for AdvancedTCA has been ratified since December 2002. The sub-specifications for Ethernet (PICMG 3.1), Infiniband (PICMG 3.2), StarFabric (PICMG 3.3), PCI Express (PICMG 3.4) and RapidIO (PICMG 3.5). The AdvancedTCA Interoperability Workshop continue and are for any participant who brings working product to test interoperability.

Bustronic and sister company Elma TreNew have developed a 14-slot Dual Star, 14-slot Full Mesh, 16-slot Full Mesh, 5-slot Replicated Mesh and 2-slot Replicated Mesh ATCA backplanes (some details below).

* IPM Sentry is a trademark of Pigeon Point Systems

Background

Advanced TCA, via the PICMG 3.0 specification, is a major effort by over 100 companies to develop a next-generation telecom architecture. The specification is geared towards the telco carrier grade market. Utilizing Dual Star, Dual Dual Star, and Mesh switched fabric topologies, the spec will be able to handle the massive bandwidth requirements, High Availability (99.999% uptime), and Quality of Service issues demanded by the industry. The form factor will go to an 8U x 280mm card size plugging into an approx. 5U (or 8U) backplane spaced at 1.2". The larger cards allow more space for more components, while the wider spacing between slots allows for taller components. In addition, the backplane allows for 48VDC input from an external source to be distributed to the individual slot cards.

Industry Articles

IEEE Presentation on ATCA Current Channels and Signaling Methodology
Measuring the Actual Performance Characteristics of ATCA Backplanes with Signal Integrity Analysis

Design Considerations for PICMG 3.0 AdvancedTCA Backplanes
Taking AdvancedTCA to the Next Level: From Development Units to Shelf Management
Integrating Shelf Management Solutions into CompactPCI and AdvancedTCA Chassis Designs

Industry Links

Elma Bustronic, Elma TreNew

Elma Bustronic and sister company Elma TreNew have co-developed a 14-slot Dual Star and a 5-slot Mesh backplane compliant to the PICMG 3.0 specifications. (More).
Elma Electronic

Elma Electronic has announced a unique 5U ATCA Development Chassis that offers 48V DC to A/C conversion for plugging to a conventional wall outlet. Also features direct shelf manager plugging. A N+1 Redundant version is expected shortly. (More).




Elma Electronic

Elma Electronic has developed a 4U horizontal ATCA chassis and 12U and 13U vertical chassis compliant to the PICMG 3.0 specifications. The Elma IPM Sentry Shelf Manager is specifically designed for AdvancedTCA solutions. (More).

 


Elma Electronic

The 2U ATCA chassis from Elma uses 33% less rack space than any standard AdvancedTCA chassis in the market today. Ideal for prototyping and development, it features a 250W A/C power supply for versatility. (More).

ERNI

ERNI Components and Tyco International have developed the ZD line of high-speed connectors, which was chosen as the connector for the PICMG 3.0 specification (More).


FAQs
AdvancedTCA FAQs (17KB)
AdvancedTCA Short Form Specification






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MicroTCA Backplane

Top News

MicroTCA is one of the newest PICMG specifications in development. MicroTCA defines a modular backplane architecture designed to support redundant "pods" of AdvancedMC (AMC) modules. The AdvancedMC modules (AMC0/.1/.2/.3) are front removable mezzanine modules first designed to be used on AdvancedTCA cards. The MicroTCA specifications is expected to be completed later this year and early adopters are beginning to build prototype products even prior to the full document's release.

Background

The MicroTCA architecture will allow large arrays of AdvancedMC modules to be used in a wide array of applications where a lower cost solution is required than could be achieved by the standard AdvancedTCA architecture. The MicroTCA backplane allows single or redundant virtual carriers to provide power management, platform management and fabric connections to greater numbers of modules than a single physical carrier card could support in a classic ATCA application. MicroTCA systems will support up to 48 single width, half height AdvancedMC modules in a 19" EIA rack or an assortment of full height modules either in single or double widths. AdvancedMC modules are targeted for such modular applications as storage arrays, firewalls, blade servers, and even home entertainment centers. Each module may dissipate between 20 and 60 watts each and the platform management scheme is designed to support applications from 99.99% to 99.999% availability. AdvancedMC module specifications have already been released and the most recent, AMC.3 (storage systems), is nearing completion.

Industry Articles

Modular MicroTCA - Bringing Flexibility to MicroTCA Systems

Industry Links

Elma Bustronic

Elma Bustronic developed a Dual Star MicroTCA backplane based upon the MicroTCA.0 Specification Rev 1.0. It features 10 AMC, 2
power, and 2 MCH slots in the full size. (More)


Elma Bustronic

The first in the line of Elma Bustronic Pico backplanes is the MicroBox. It features slots for 6 AMC, 1 PM (Power Module), 1 MCH (MicroTCA Carrier Hub), 1 JSM (J-TAG Switch Module) and 2 CUs (Cooling Units). Compression-mount connectors are used in the backplane for increased reliability and superior (easier and more flexible) routing.

 

Elma Electronic

Elma now offers ruggedized MicroTCA solutions in ATR and 19” rackmount versions. (More)



Elma Electronic

Elma has developed MicroTCA Subrack Chassis in 4U, 5U, 6U, 7U, and 8U heights. The units feature front air intake, rear exhaust, and hold up to 12 AMC modules in the Star version and 10 AMCs in the Dual Star version. (More)

Elma Electronic

Compliant to MicroTCA.0 specification, the MicroSlim is designed to offer the performance benefits of MicroTCA within a space-saving 1U high platform. Optimizing the available space (up to 10, mid-sized, single-width modules) the MicroSlim Classic holds 6 x AMC modules while providing MCH and J-TAG Switch Module (JSM) capability. Powered by a robust 380 watt PSU, the MicroBox box converts 48VDC efficiently to the 3.3V and 12V’s needed to power the modules.(More)

 






CompactPCI Express (EXP0)

Top News

Elma Bustronic is completing the design of a 4-slot CompactPCI Express hybrid backplane. It contains a system slot, one Type 1 slot, and two Type 2 slots. Contact Elma Bustronic for more details. The high performance capability of the new CompactPCI architecture makes possible performance levels that will support such features as a new generation of video graphic capability. The backward compatibility to CompactPCI and the wealth of user available backplane IO of the P3, P4 and P5 connectors will allow many new specialized applications to be supported while continuing to support all existing card designs. PXI Express versions are also coming soon.

Background

CompactPCI Express supports the next generation Intel PCI Express architecture in the familiar 6U-160 Eurocard form factor. CompactPCI Express connects cards via a serial point-to-point bus with a read-only bandwidth of up to (16x) 2.5 Gigabits/second or (8x) 2.5 Gigabits/second full duplex bandwidth. CompactPCI Express provides support for several different card for factors with connectivity in 1x, 2x 4x, and 8x increments. Each link represents one full duplex 2.5 Gigabit/second interconnect path. The support of legacy 32 or 64 bit CompactPCI boards is accomplished by a PCIe to PCI-X bridge. CompactPCI boards of 33MHz, 66MHz, or 133MHz are possible. Because the CompactPCI Express architecture continues to support the P3, P4 and P5 in all 6U slot types, CompactPCI Express can continue to support for all existing CompactPCI secondary architectures such as PICMG 2.5, 2.20, 2.16, 2.17 and 2.18 either as functions on native CompactPCI Express cards or as legacy cards in the original CompactPCI form. Versions for PXI Express will also be available.

Industry Articles

The Power is the System

Industry Links

Elma Bustronic

Elma Bustronic has developed a 3U CompactPCI Express backplane in 4-slots. It contains a system slot, one Type 1 slot, and two Type 2 slots. The backplane features a bridgeable section for a PCI-to-PCIe bridge.


Elma Bustronic, Elma TreNew

Elma Bustronic and sister company Elma TreNew developed this 6-slot CompactPCI Express backplane. This 3U version features two Type 1 slots, two Type 2 slots, and 2 legacy cPCI slots.